RFEVM216

RFEVM216

The RFEVM216 development kit comprises the RFSoM216 SoM and the RFEVM200 base board, linked by a 56Gbps high-speed connector. The RFSoM216 SoM features Xilinx's Zynq UltraScale+ RFSoC Gen3 XCZU49DR FPGA as its main chip, supporting 16-channel 14-bit RF-ADC with a maximum sampling rate of 2.5GSPS. And it includes a 16-channel 14-bit RF-DAC with a maximum sampling rate of 9.84GSPS.

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Dev Board & Kit with AMD Zynq™ US+ RFSoC ZU49DR

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Overview
Product Information
Product Selection Matrix
Documentations
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Overview

Applications

· Wireless access

· Test and measurement

· Early warning/radar

· Cable TV access

· Other high-performance RF applications

The RFEVM216 development kit comprises the RFSoM216 SoM and the base board, linked by high-speed connectors (32Gbps per channel). The RFSoM216 SoM features Xilinx's Zynq UltraScale+ RFSoC Gen3 XCZU49DR FPGA, supporting 16-channel 14-bit RF-ADC (2.5GSPS max) and 16-channel 14-bit RF-DAC (9.85GSPS max). This integration simplifies the RF signal chain, maximizes I/O density without sacrificing bandwidth, leverages heterogeneous processing, and reduces power consumption. Connectors extend RF-ADC/RF-DAC interfaces, clocks, MIO, GTY transceivers, and support configurable IO voltages on specific banks.

Product Description

Key Features

· AMD/Xilinx Zynq™ Ultrascale+™ RFSoC Gen3 ZU49DR:

· 930K Logic Cells

· 16 x 14bit 2.5 GSPS RF-ADC

· 16 x 14 bit 9.85GSPS RF-DAC

· ARM® quad-core Cortex™-A53 up to 1.3GHz

· ARM® dual-core Cortex™-R5F up to 533MHz

· 16nm FinFET+ FPGA fabric

· Pluggable module with a 56Gbps high-speed connector

· Single channel 5GB DDR4 SDRAM ECC on PS

· Dual channel 5GB DDR4 SDRAM on PL

· 128 MB QSPI Flash

System-on-Module

Key Features

· 2 x QSFP28 Optical (40G/100G)

· 1 x FMC+

· RF MCXs

· 16 x 14bit RF-ADC @ 2.5 GSPS

· 16 x 14bit RF-DAC @ 9.85 GSPS

· 1 x M.2 Interface

· 1 x MINI DisplayPort

· 1 x GPS

· 1 x USB 3.0 OTG Interface

· 1 x Gigabit Ethernet

· 1 x JTAG/UART (USB-C)

· 1 x Micro SD

· 1Mbit I2C Serial EEPROM

· 4 x LED

· 1 x KEY (1 x RESET )

· 12V single supply

· Dimensions: 277 x 180 mm form factor

Base Board

Supporting 5G baseband, cable TV access, and wireless communication applications; test and measurement, radar/early warning systems, satellite positioning, and other high-performance RF scenarios.

Product Information

Development Board Features

Featuring the AMD/Xilinx's Zynq™ UltraScale+™ RFSoC XCZU49DR-2FFVF1760 Adaptive SoC

Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.

The V3 development board help shorten time-to-market for any AMD/Xilinx Zynq™ UltraScale+™ RFSoC based application.

* The RFEVM216 development board consists of a RFSoM216 SoM and base board. If you want to purchase RFSoM216 SoM separately.

Please check the Relevant Products at the bottom of the page and click to learn more details.
What's Inside the Box

V3 AMD Xilinx Zynq™ UltraScale+™ RFSoC ZU49DR development board and Some accessories

Heatsink Kit is an optimal cooling solution for V3 FPGA and SoC modules – it is low-profile and covers the whole module surface.