RFEVM

RFEVM

The RFEVM is an integrated RF processing platform featuring AMD's Zynq UltraScale+ RFSoC Gen3 ZU47DR-2FFVE1156I chip with 8-channel 14-bit 5GSPS RF-ADCs, 8-channel 14-bit 9.84GSPS RF-DACs, and heterogeneous ARM+FPGA processing for 5G, radar, and satellite applications.

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Dev Board & Kit with AMD Zynq™ US+ RFSoC XCZU47DR

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Overview
Product Information
Product Selection Matrix
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Overview

Applications

· 5G FR1/FR2 Baseband & RF Systems

· Wideband Spectrum Monitoring & Analysis

· Phased-Array Radar / Digital Array Radar (DAR)

· Satellite Communications

· Multi-channel RF Signal Processing (for SDR, test equipment)

· Test & Measurement (T&M) Systems

The RFEVM development board adopts the AMD Xilinx Zynq UltraScale+ RFSoC Gen3 series ZU47DR FPGA chip, integrating high-performance RF data converters, programmable logic, an ARM Cortex-A53 processing subsystem, and multi-gigabit transceivers. It supports 8-channel 14-bit RF-ADCs with a maximum sampling rate of 5 GSPS, and 8-channel 14-bit RF-DACs with a maximum sampling rate of 9.85 GSPS. The RF interfaces offer wide frequency band support through configurable coupling and conditioning circuits. It provides a comprehensive RF signal chain that maximizes I/O channel density and bandwidth while leveraging heterogeneous processing capabilities for reduced power consumption.

Product Description

Key Features

· AMD/Xilinx Zynq™ Ultrascale+™ RFSoC Gen3 XCZU47DR:

· 930K Logic Cells

· 8 x 14 bit 2.5GSPS RF-ADC

· 8 x 14 bit 9.85GSPS RF-DAC

· ARM® quad-core Cortex™-A53 up to 1.333GHz

· ARM® dual-core Cortex™-R5F up to 533MHz

· 16nm FinFET+ FPGA fabric

· Digital RF-ADC, RF-DAC

· Pluggable module with 2 x Samtec board-to-board connectors

· 4 GByte (64-bit) DDR4 SDRAM on PS

· 2 GByte (32-bit) DDR4 SDRAM on PL

· 128 MB QSPI Flash

System-on-Module

Key Features

· 1 x M.2 Interface

· 1 x QSFP28 fiber optic

· 1 x SFP28 fiber optic

· 1 x Gigabit Ethernet

· RF MCXs

· 8 x 14bit RF-ADC @ 5.0 GSPS · 8 x 14bit RF-DAC @ 9.85 GSPS

· 1 x USB3.0

· 1 x UART on PS (USB to UART)

· 2 sets of PL IOs (x8), 1 set of PS IOs (x10)

· 1 x JTAG

· 1 x Micro SD

· EEPROM: 1Mbit I2C Serial EEPROM + 1 x Temperature sensor

· 4 x LED

· 1 x KEY (1 x RESET )

· 12V single supply

· Dimensions: 254 x 180 mm form factor

Base Board

Designed for large-scale MIMO systems, 5G baseband processing, fixed wireless access (FWA), cable TV access, test and measurement (T&M), satellite communications, phased-array radar/digital array radar (DAR), and other high-performance RF applications.

Product Information

Development Board Features

Featuring the AMD/Xilinx's Zynq™ UltraScale+™ RFSoC XCZU47DR-2FFVE1156I Adaptive SoC

Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.

The V3 development board help shorten time-to-market for any AMD/Xilinx Zynq™ UltraScale+™ RFSoC based application.

* The RFEVM development board consists of a RFSoM and base board. If you want to purchase RFSoM separately.

Please check the Relevant Products at the bottom of the page and click to learn more details.
What's Inside the Box

V3 AMD Xilinx Zynq™ UltraScale+™ RFSoC ZU47DR development board and Some accessories

Heatsink Kit is an optimal cooling solution for V3 FPGA and SoC modules – it is low-profile and covers the whole module surface.